Here’ s what AMAT CEO Gary Dickerson had to say about the company’s guidance and defense of their long term opportunity:
“For Applied’s business, there are 3 main factors that mute our outlook for the quarter ahead. First is digestion of capacity in China. Second is our large backlog of pending export license applications where we have taken a conservative position and assumed none of these licenses will be issued in the next quarter. And third is nonlinear demand from leading-edge customers which is primarily linked to market concentration and fab timing. None of these near-term considerations change our perspective on the longer-term opportunities for the industry and Applied Materials. Leadership in AI remains a major focus for both companies and countries, driving large investments in infrastructure and R&D. Governments around the world, especially the United States government are taking major steps to incentivize companies to build advanced manufacturing capacity onshore.
One example of this is Apple’s American manufacturing program, which was announced last week. We are excited to be a partner in this initiative that is designed to strengthen the end-to-end silicon supply chain in the U.S. As part of this endeavor, we plan to invest more than $200 million in Arizona to establish a state-of-the-art facility for manufacturing specialized components for our equipment. This builds on the more than $400 million we have invested in our U.S. manufacturing infrastructure over the past 5 years to provide the needed capacity and agility to support growing customer demand. Globally, we are now tracking more than 100 new fabs or major fab expansion projects, an increase of about 10% in the past year.
In addition to robust supply chains, deploying AI at large scale requires significant innovation at every level of the technology stack from models, software and data center design to chip architectures and materials. AI’s need for abundant, high-performance and energy-efficient computing is reshaping the semiconductor road map and changing the way chips are designed and manufactured. This next wave of AI semiconductor innovation will be concentrated around 5 key areas: Leading edge logic next-generation high-performance DRAM, high bandwidth memory or DRAM stacking, advanced packaging to connect logic and memory chips together and innovations in power electronics to address energy consumption within the data center and more efficient grid to data center power delivery.
In each of these critical areas, major device architecture inflections are shifting value towards material science and materials engineering, growing Applied’s addressable market and driving closer collaboration with customers. On top of this, these inflections create opportunities for us to grow faster than the underlying market. Based on our deep customer engagements, we have focused our investments in product portfolio on the most enabling applications, and we expect healthy market share gains as these new technologies ramp in volume production. Let me walk you through some examples. — in leading-edge foundry logic, the transition from FinFET to gate-all-around transistors with backside power delivery grows our revenue opportunity by 30% for the equivalent fab capacity. And we are on track to gain multiple points of market share when these nodes ramp in the second half of 2026 and 2027. “